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Neuromorphic Computing Market To Reach USD 82.1 Billion By 2032 | DataHorizzon Research
Surge in Investments and Rise in Research and Development to Boost Neuromorphic Computing Industry Growth....
News for Nepes Corporation (033640.KQ)
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mixedmixedGlobal IC Packaging Market to Surpass USD 77.89 billion by 2030 Driven by Increasing Government Support
SkyQuest projects that the global IC packaging market will attain a value of USD 77.89 billion by 2030, with a CAGR of 8.37% during the forecast period...- Published at
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mixedmixedFan-Out Wafer Level Packaging Market to exceed $5Bn by 2032, Says Global Market Insights inc.
Fan-Out Wafer Level Packaging Industry size is expected to register 10% CAGR between 2023 and 2032 propelled by the growing penetration of miniaturized...- Published at
- by globenewswire.com
mixedmixedSemiconductor Advance Packaging Market Poised to Reach USD 61.69 billion by 2029, exhibiting a CAGR of 7.65% | Exactitude Consultancy
Advanced packaging has become critical to integrating improved functionality into a wide range of devices, including cellular phones and cars, by enabling...- Published at
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neutralneutralAdvanced Packaging Market to Exceed US$ 61.3 Billion by 2033 as Sales of Embedded Die Packaging Solutions Burgeons Globally | Future Market Insights, Inc.
The USA advanced packaging market is expected to reach a valuation of US$ 9.9 billion by 2033. It is anticipated to exhibit 6.6% CAGR from 2023 to 2033. ...- Published at
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neutralneutralValued To Be $50.6 Billion By 2026, Semiconductor Advanced Packaging Slated For Robust Growth Worldwide
SAN FRANCISCO, Dec. 8, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today