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News for Shinko Electric Industries Co., Ltd. (6967.T)
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mixedmixedYamaichi Electronics : Notice of Convocation Annual General Meeting 2024
Note: This document has been translated from a part of the Japanese original for reference purposes only. In the event of any discrepancy between this translated document and the...- Published at
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mixedmixedGlobal IC Packaging Market to Surpass USD 77.89 billion by 2030 Driven by Increasing Government Support
SkyQuest projects that the global IC packaging market will attain a value of USD 77.89 billion by 2030, with a CAGR of 8.37% during the forecast period...- Published at
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positivepositiveGlobal Advanced IC Substrate Market Size is Projected to Reach USD 14.2 Billion in 2030, Growing at a CAGR of 6.98%: Straits Research
Due to the rise in demand for 5G capable smartphones and smart wearables globally over the upcoming years, it is anticipated that the need for...- Published at
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mixedmixedGlobal Organic Substrate Packaging Material Market is forecasted to grow by USD 3.51 billion during 2022 to 2027
/PRNewswire/ -- The organic substrate packaging material market size is estimated to grow at a CAGR of 4.7% between 2022 and 2027. According to Technavio, the...- Published at
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mixedmixedMicro Packaging Market to Surpass 2006.89 Million by 2030 Drives Due to the Technological Advancements
SkyQuest projects that the micro packaging market will attain a USD 2006.89 Million value by 2030, with a CAGR of 5.8% over the forecast period...- Published at
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neutralneutralEurope Advanced IC Substrates Market Report 2023: Rising Adoption of Advanced Substrates in Manufacturing of Electronics Boosts Growth
/PRNewswire/ -- The "Europe Advanced IC Substrates Market 2022-2031 by Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application,...- Published at
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neutralneutralAsia Pacific Advanced IC Substrates Market Report 2022: Rising Adoption of Advanced Substrates in Electronics Manufacturing Boosts Sector
/PRNewswire/ -- The "Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type, Material Type, Manufacturing Method, Bonding Technology,...- Published at
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negativenegativeSemiconductor Lead Frame Market Exhibits 6.9% to Reach USD 5.32 Billion by 2029
As per the report by Fortune Business Insights, the global Semiconductor Lead Frame Market size is projected to reach USD 5.32 Billion in 2029, at a CAGR...- Published at
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mixedmixedOutlook On The Organic Substrate Packaging Material Global Market To 2026 - By Technology, Application And Region
DUBLIN, Nov. 24, 2021 /PRNewswire/ -- The "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast