News for Powertech Technology Inc. (6239.TW)

The OSAT industry is growing rapidly, driven by semiconductor advancements and rising demand for miniaturized electronics in consumer, automotive, and...

SkyQuest projects that the global IC packaging market will attain a value of USD 77.89 billion by 2030, with a CAGR of 8.37% during the forecast period...

The global semiconductor packaging market is segmented based on material, application. By material, the market is segmented into organic, organic, and...

The OSAT market is experiencing growth ascribable to technological advancements and strategic affiliations....

Discover top Semiconductor Assembly Test Services Market providers. Get expert semiconductor testing and assembly solutions for optimal chip performance. ...

Companies leading the Motion Control Software in Robotics Market ABB Ltd., Omron Corporation, Fanuc, KUKA AG, Yaskawa Electric Corp., Teradyne, Yamaha,...

Increasing semiconductor goods per automobile and developments such as autonomous and electric vehicles are the primary drivers for semiconductor...

/PRNewswire/ -- The Semiconductor Advanced Packaging Market is projected to have remarkable growth, with a Compound Annual Growth Rate (CAGR) of 8.5% between...

/PRNewswire/ -- The Wire Bonder Equipment Market is projected to have remarkable growth, with a Compound Annual Growth Rate (CAGR) of 3.3% between 2022 and...

As per the report by Fortune Business Insights, the global Semiconductor Assembly and Test Services Market size is projected to reach USD 46.24 billion by...

/PRNewswire/ -- The semiconductor packaging materials market is expected to grow by USD 10,158.72 million from 2022 to 2027, according to Technavio. As per the...

SkyQuest projects that the micro packaging market will attain a USD 2006.89 Million value by 2030, with a CAGR of 5.8% over the forecast period...

According to Future Market Insight's research study, the global semiconductor packaging market, poised to hit US$ 28.6 billion in 2023, thrives on...

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Acumen Research and Consulting recently published report titled “Semiconductor Assembly and Testing Services Market Forecast, 2023 - 2032”...

/PRNewswire/ -- The semiconductor advanced packaging market is set to grow by USD 21,157.5 million from 2022 to 2027 progressing at a CAGR of 8.5% during the...

Fan-Out Wafer Level Packaging Industry size is expected to register 10% CAGR between 2023 and 2032 propelled by the growing penetration of miniaturized...

/PRNewswire/ -- The semiconductor assembly and testing services market is estimated to grow by USD 18,136.79 million during 2022-2027. However, the growth...